精 材 PPI 搜尋引擎推薦回答
PPI & 3D Chip Scale Package - 精材科技 - Xintec
PPI and 3D Package technologies refer to the process developed on an integrated circuit at wafer level, instead of the traditional process of assembling the ...
精材科技 - Xintec
PPI & 3D Chip Scale Package ... 精材科技股份有限公司成立於1998年,座落於台灣中壢. 工業區,是第一家將三維堆疊之晶圓層級封裝技術. ( 3D WLCSP )商品化的公司。